Royi 2000-4000 MHz 40W 50W RF High Power Vco WiFi Jammer Module Country Drone 4G 10W 20W Anti Drone Module for Anti Drone System

• Customization: Available
• Type: RF Module
• Certification: ISO
• Model NO.: YXA204047F
• Condition: New
• Operating Temperature: -40ºC~150ºC
• Place of Origin: Chengdu
• Chipset: Standard
• Dimensions: 125 X 80 X20mm
• Application: Drone Blocker
• Model Number: Yxa204047f
• Supplier Type: Manufacturer
• Cooling System: Yes
• RF Connectors: SMA-F / SMA-F
• Frequency: 2000-4000 MHz
• Power Consumption: 50W
• Transport Package: Box
• Trademark: OEM
• Origin: China
• HS Code: 85437092
• Production Capacity: 500000

Product Description

DESCRIPTION
The YXA204047F is a 2000 to 4000 MHz amplifier which is guaranteed to deliver 50W minimum output power and related RF performance under all specified temperature and environmental conditions. This  GaN module is designed for commercial applications. It is capable of supporting any signal type and modulation format,The latest device technologies and design methods are employed to offer high power density, efficiency, and linearity in a small,light weight package.

FEATURES
Overvoltage, Undervoltage, and Reverse Voltage Protection
High-Speed On/Off Control
Over-Temperature Protection
Overcurrent Protection
Optional Heatsink

 

Specifications subject to change without notice. Typical performance at  VDC +25oC,and in a 50Ω system.

TX : PARAMETER	Symbol	MIN	TYP.	MAX	UNIT
Operating Frequency	BW	2000		4000	MHz
P-sat  Output	Pout	/	47	/	W
Gain   (31.5dB adjustable)	S21	/	50	/	dB
Gain Flatness	GF	/	±1.5	/	dB
VSWR(Max)	VSWR	/	1.6	/	-
Operating Voltage	/	/	+28V	/	V
Current Draw(Max)	/	/	7	/	A
Quiescent Current Draw	/	/	1.2	/	A
Dissipate heat	Heat Sink

 
Ordering information

Model Number	Description
YXA204047F	Optional Heat sink

Frequency Range: 2000-4000 MHZ

RFOUT POWER1=48dBm(60W)
RFOUT POWER2=47dBm(50W)
RFOUT POWER3=46dBm(40W)
RFOUT POWER4=45dBm(30W)
RFOUT POWER5=43dBm(20W)
RFOUT POWER6=40dBm(10W)

 GAN's chip has the following 3 advantages over LDMOS:

1. High work efficiency;

2. The use of ceramic tube shell enhances heat dissipation and greatly improves stability;

3. The open-circuit state will not burn out the chip;